in My Work, Process

Week 13: Resin Encapsulation

What is resin encapsulation: Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

Materials needed: Mould, items to encapsulate, resin liquid, wax spray

How it’s done:

Step 1: Prepare the resin liquid

Step 2: Wax the mould with a wax spray

Step 3: Gather objects and place into the mould, you can also add objects in during the process (if u want the object to be at a specific spot)

Step 4: Once you’re done with arranging, pour the resin liquid into the mould and leave it to dry up in the sun

Step 5: When you see steam coming out, this means that the encapsulation is ready to be taken out of the mould.

Making the resin liquid

Place objects into wax sprayed mould

Pour resin liquid into mould

Resin moulds in the sun


Reflection: This technique is relatively simple, however getting the liquids to the right temperature was abit tricky. I really love and appreciate the fact that we can keep living things “alive” and in their original forms after death. Resin encapsulation¬†will be great if you’d like to make gifts for your loved ones!

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